High-power LED lighting at work will produce more heat, you need to export through the radiator and the heat released into the environment. This paper systematically describes the characteristics of various types of main radiator, and its performance characteristics were analyzed material and presentation.
LED (Light-emittingDiode acronym) lighting refers to the use of semiconductor light-emitting diodes as a light source technology of a new environmentally friendly lighting products. There are energy saving LED lighting, easy to control, maintenance, safety and environmental protection, long service life, up to 50,000-100,000 hours of its life, far more than the traditional incandescent light bulbs and fluorescent tubes of 1,000 hours to 10,000 hours . LED as a new energy-saving, environmentally friendly green lighting products, and its prospects are very optimistic, but the LED light on the job while most of the energy to be converted into heat, if the heat can not be dissipated, LED junction temperature will continue increases, when the LED junction temperature exceeds a certain limit can not be backlit failure occurs, resulting in reduced life LED work or even damage, so LED lamps require self-generated heat radiator shed to work properly.

I. High-power LED lamps for general lighting (1W above) introduced

A common type -. Bulb, lighting, candle lights, tube lights, ceiling lights, lights, etc., and according to the specifications of different interfaces have many models (some lamps sample shown in Figure 1).

The basic structure of LED lights include three parts, A: light source structure: the LED light board including a light emitter, LEDPCB panels; B: LED driver power supply, can be divided into isolated and non-isolated power supply; C: LED heat dissipation, astigmatism or light guide components include: LED heat sink, LED lampshade or LED light guide body and so on. The basic shown in Figure 2.

Two. LED heatsink efficient and safe working principle

The main effect of the heat sink of the LED chip is working continuously generated and distributed to export the environment, the wafer temperature is maintained within the desired range, to ensure the LED can work properly. Heat from the LED chip produced mainly in heat conducting manner passes through the LED package structure, the circuit board, heat lamps structure, and finally by convection (convection and conduction) and the heat radiation in which the heat from the radiating structure transmitted to the environment. Common LED radiator cooling mode is shown.

The quality depends on the radiator to meet safety conditions, thermal resistance of the heat sink. Thermal resistance, the lower the LED lights under the same conditions junction temperature, the lower the LED junction temperature, the longer the life of the chip. The thermal resistance of the heat sink thermal resistance and heat dissipation should include the thermal resistance of two parts. For a certain shape of the radiator, and the thermal resistance of the heat sink material is mainly related to, the greater thermal conductivity, thermal resistance is smaller, the better the thermal conductivity; under certain environmental conditions, the thermal resistance mainly depends on the heat radiating 's cooling area and the radiation coefficient radiator surface materials, cooling area, the higher the radiation coefficient, the smaller the thermal heat, heat the better.

Three. Different materials commonly introduced LED heatsink

The so-called LED heatsink is the ability to work in the heat generated by the LED chip to quickly export and distribute a component to the environment, so as a heat sink only a certain area is not enough heat, making the heat sink material must have a certain thermal conductivity, that is, to have a high thermal conductivity to the heat generated by the chip exported continuously and finally dispersed into the environment; course, the thermally conductive material, in addition to thermal conductivity, should also have a small specific gravity, low price , high strength, easy processing characteristics.